|
|
|
| |
|
Ex-Therm is a combination of high thermal conductivity and superior flame-retardancy
with specific organic properties of heat resistance and electrical insulation.
Ex-Therm offers excellent heat transfer between heat sink and semiconductor package
surface where surfaces are rough.
|
| |
| Application |
- High Speed Mass Storage Drives
- Power Supplies
- Micro Processors, Memory Chips and Chipsets
- Automotive Engine Control Units
- Telecommunication Hardware
|
| Sheet Type (EXHT-S1) |
- Has high thermal conductivity of 4.0W/mK to produce low thermal impedance
- Electrically insulating and stable from -30C to 200C
|
.jpg) |
| Enquire about Sheet type (EXHT-S1) |
|
Sheet type (EXHT-S1)