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Ex-Therm is a combination of high thermal conductivity and superior flame-retardancy
with specific organic properties of heat resistance and electrical insulation.
Ex-Therm offers excellent heat transfer between heat sink and semiconductor package
surface where surfaces are rough.
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| Application |
- High Speed Mass Storage Drives
- Power Supplies
- Micro Processors, Memory Chips and Chipsets
- Automotive Engine Control Units
- Telecommunication Hardware
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| Gel Type. (EXHT-G1) |
- EXHT-G1 is very soft, freestanding gap filler that is more compressible than any other gap filler.
- EXHT-G1 is inherently sticky, so not necessary to use additional adhesive.
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| Enquire about Gel Type (EXHT-G1) |
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Gel Type (EXHT-G1)